锦鲤求职岗位描述
Lead LED packaging design projects including COB and high-power modules.
Develop and optimize packaging structures for thermal and optical efficiency.
Select and validate packaging materials such as substrates, adhesives, and encapsulants.
Perform thermal, optical, and mechanical simulations to ensure design robustness.
Collaborate with cross-functional teams for product integration and performance optimization.
Establish and maintain packaging process standards and documentation.
Support reliability testing and failure analysis for continuous improvement.
Drive innovation in packaging technology and participate in patent applications.
Ensure compliance with industrial and environmental regulations.
Who we are looking for
Bachelor’s degree or above in Materials Science, Electronics, or related field.
8+ years experience in LED packaging or semiconductor packaging.
Proficiency in thermal and optical simulation tools (ANSYS, LightTools).
Strong knowledge of packaging materials and reliability standards.
Excellent project management and cross-functional communication skills.
Fluent in English and Mandarin for technical communication.
Please contact Ke Li for further information via or +86 510 81908308.