锦鲤求职岗位描述
岗位职责
1. 负责标识及可追溯性控制的实施。
2. 负责产品工艺的制定及改善，如调芯、研磨等工艺。
3. 负责产品功能检测、外观检查等方法的制定及工艺改善。
4. 负责FMEA等文件制定。
5. 负责制程SOP制定与样品制作。
6. 负责制程各岗位的人员培训。
7. 负责产品生产指令单的制定。
8. 负责样品出货，与客户对标确认。
9. 负责新供应商物料验证工作。
10. 负责客户端异常问题的处理。
Responsibilities
1. Responsible for implementing identification and traceability controls.
2. Responsible for defining and improving product processes such as core alignment and polishing.
3. Responsible for defining and improving methods for functional testing and visual inspection.
4. Responsible for preparing FMEA and related documents .
5. Responsible for developing process SOPs and building samples.
6. Responsible for training personnel across process stations.
7. Responsible for preparing production work orders.
8. Responsible for sample shipments and benchmarking/confirmation with customers.
9. Responsible for material verification of new suppliers.
10. Responsible for handling customer-side abnormality issues.
岗位要求
1. 硕士及以上学历，工业工程、机械、光学、光电信息、电子、通信、材料、微电子、测控等相关专业。
2. 了解光模块或半导体封装基本概念（贴片、键合、耦合、检测等），有相关实习经验者优先。
3. 具备2D/3D图纸识图及绘图能力（AutoCAD、SolidWorks等）者优先。
4. 熟练使用Office系列办公软件，能使用常用软件处理数据、对数字敏感。
5.英语 CET-4 及以上，CET-6 优先；具备良好听说读写能力。
6. 动手能力强，善于发现并解决问题。
7. 具备良好的协调沟通能力与责任心。
Qualifications
1. Master's degree or above in Industrial Engineering, Mechanical, Optical, Optoelectronic Information, Electronic, Communication, Materials, Microelectronics, Measurement & Control, or related fields .
2. Basic understanding of optical modules or semiconductor packaging (die bonding, wire bonding, coupling, inspection, etc.); lab hands-on or production internship experience preferred.
3. Ability to read and draft 2D/3D engineering drawings (AutoCAD, SolidWorks, etc.) preferred.
4. Proficient in Microsoft Office; able to process data with common tools and numerically sensitive.
5.CET-4 or above (CET-6 preferred); good listening, speaking, reading, and writing skills.
6. Hands-on with a knack for identifying and solving problems.
7. Strong coordination and communication skills with a sense of responsibility。