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灿芯半导体

Backend Design Engineer

  • 社招
  • 苏州 / 合肥 / 成都 等
  • 半导体/芯片
  • 发布于 2026-08-17
原岗位链接 ↗

岗位描述

岗位职责
1. Responsible for the development and support of customer based design form netlist to GDS tape out;
2. Responsible for block floorplan, CTS, Power plan, Placement & Routing, SPF extraction, STA and Physical verification.

岗位要求
1.M.S. or B.S. degree in EE or equivalent
2.3+ years of experience and minimum of BS in EE or equivalent; MS is a plus
3. Background in block level Place and Route.
4. Scripting expertise (Perl, Tcl, or Python) a strong plus;
5. Actual chip tapeout experience on advance technology node (28nm or below) a strong plus.
6. Self-motivated, good communication skill and team work spirit.

*公司坚持平等原则,公平公正对待不同背景的员工,包含但不限于国籍、性别、宗教信仰、文化背景等方面,提供平等发展机会,构建多元化人才体系

半导体/芯片方向的申请准备

先核对岗位要求与自己的经历,再准备档案、投递和面试。

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