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平头哥

平头哥-AI芯片互联架构师-上海

  • 社招
  • 上海
  • 硕士及以上
  • 半导体/芯片
  • 发布于 2026-10-19
原岗位链接 ↗

岗位描述

岗位职责
In this role, you will work with hardware and software engineering groups to define the next-generation inter-chip network architecture for high-performance AI chip and AI network.

* Identifies the challenging problems, and evaluate various architectural solutions for the next-generation of network for AI chip and AI Super Pod.
* Gets strong influences on future AI products by advanced architecture design as the excellent interface between software and hardware.
* Architecture design of AI chip to chip interconnect subsystem, Scale-up Switch chip, C2C link, and etc.
* Documents the high-level architecture specification.
* Participation in defining the micro-architecture of key subsystem.
* Strong technical leadership to achieve successful delivery of final silicon product.
* Works closely with design, software, system, and verification team.

任职要求
* Minimum Bachelor degree in Computer Science or Electronics Engineering; M.S. or Ph.D. degree is preferred.
* Minimum of 5 years (for M.S.) 3 years (for Ph.D.) of experience on computer architecture or network chip design.
* Smart and show good potential in at least one of the following areas:
1.Server AI chip.
2.Smart NIC/RDMA/RoCE/DPU.
3.State-of-the-art Switch chip.
* Hand-on experience of high-speed interface, such as Die to Die, high speed long-reach SerDes, MAC/PCS, FEC is a plus.
* Hand-on experience of interconnects in AI domain is a big plus.
* Strong knowledge of AI infrastructure and AI network including Scale-up/Scale-out network, and knowledge of LLM inference and training is a big plus.
* Good verbal and written skill for communication.

半导体/芯片方向的申请准备

先核对岗位要求与自己的经历,再准备档案、投递和面试。

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