Product Engineer -Thermal / Multiphysics & PDK

Responsibilities：

1. Support foundry and PDK teams in developing and validating thermal-related technology files and PDK enablement flows for advanced semiconductor and 3DIC applications.

2. Support thermal, electro-thermal, and multi-physics analysis flows, and provide related technical troubleshooting.

3. Work closely with customers, foundries, Product Engineering, and R&D teams to resolve technical issues and improve methodologies and workflows.

4. Support customer adoption of 3DIC and multi-physics solutions through technical guidance, demonstrations, and training.

5. Develop scripts and automation solutions to improve simulation, PDK validation, and engineering workflows, including AI-assisted approaches where applicable.

Requirements：

1. BS with 3–5+ years or MS with 1–5+ years of relevant experience in Electrical Engineering, Microelectronics, Mechanical/Thermal Engineering, Applied Physics, Computer Engineering, Computer Science, or related fields.

2. Experience with thermal or multi-physics analysis, with knowledge of thermal simulation and exposure to EM, SI/PI, power integrity, or related methodologies. Hands-on experience with commercial simulation tools such as Celsius, Clarity, Icepak, HFSS, or equivalent tools is preferred.

3. Familiarity with semiconductor manufacturing processes, IC design flows, and PDK development or enablement.

4. Good scripting/programming skills in Python, SKILL, Tcl, Perl, or similar languages.

5. Good analytical, troubleshooting, communication, collaboration, and English skills.

6. Experience with 3DIC, Chiplet, multi-die, advanced packaging, or Custom IC / EDA environments is a plus.

7. Experience with EDA automation, AI-assisted engineering, AI agent / LLM integration, or AI-enabled engineering workflows is a plus.