Underfill Equipment Engineer(J17562)

岗位职责
1.Develop, qualify, and optimize capillary and molded underfill processes for SiP and flip-chip products.
2.Establish process parameters for dispensing, material flow, curing, fillet formation, and coverage.
3.Program and maintain automated dispensing platforms, including Nordson ASYMTEK or equivalent systems.
4.Evaluate underfill materials based on viscosity, flow performance, Tg, CTE, modulus, adhesion, cure profile, and reliability.
5.Apply DOE, statistical analysis, and process capability studies to define robust operating windows.
6.Investigate and eliminate defects such as voids, delamination, incomplete coverage, filler separation, overflow, and die contamination.
7.Conduct failure analysis using CSAM, X-ray, cross-sectioning, microscopy, and other analytical techniques.
8.Improve yield, cycle time, material utilization, equipment uptime, and overall manufacturing performance.
9.Prepare process specifications, control plans, work instructions, qualification reports, and technical documentation.
10.Support new-product introduction, process transfer, equipment qualification, and production ramp-up.

岗位要求
1.Bachelor's in Materials Science, Chemical Engineering, Mechanical Engineering, Manufacturing Engineering, or a related discipline.
2.At least 3 years of relevant experience in semiconductor assembly, advanced packaging, underfill, encapsulation, or precision fluid dispensing.
3.Strong understanding of flip-chip assembly, capillary flow, polymer behavior, curing mechanisms, and package reliability.
4.Hands-on experience with automated dispensing equipment; Nordson ASYMTEK experience is highly preferred.
Practical knowledge of underfill material properties, including viscosity, Tg, CTE, modulus, adhesion, moisture sensitivity, and flow rate.
5.Experience using CSAM, X-ray inspection, cross-sectioning, microscopy, and other failure-analysis methods.
Proficiency in DOE, SPC, statistical analysis, process capability, root-cause analysis, and corrective-action methodologies.
6.Experience in process qualification, equipment validation, new-product introduction, and high-volume manufacturing.
7.Strong analytical, troubleshooting, documentation, and cross-functional communication skills.